COB LED

With COB (Chip-on-Board), the bare LED chips are bonded directly onto the board and covered together with a protective resin layer, without separate packages. That enables very fine pixel pitch (P0.9 and smaller, up to 4K and 8K resolution), with higher robustness, better contrast and better heat dissipation than SMD. Between SMD and COB there is also IMD (N-in-1), in which several pixels are integrated into one package.